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Silicon dioxide(CAS#14808-60-7)

Chemical Property:

Molecular Formula O2Si
Molar Mass 60.08
Density 2.2
Melting Point 1610℃
Boling Point 2230℃
Water Solubility insoluble
Appearance Colorless, odorless solid
Storage Condition Room Temprature
MDL MFCD00011232
Physical and Chemical Properties Glass-like or translucent coarse particles. The specific surface area is 450m2/g or more, and is a highly active, renewable, microporous structure and high thermal stability material. It has a strong adsorption capacity for liquid and gas phase substances. The hardness was slightly softer than that of glass. In addition to hydrofluoric acid and strong alkali, insoluble in other chemical solvents.
Use It is used as a dehumidifying desiccant, a dehydrating agent, a moisture barrier, and an air humidity regulator. It is also used for the drying of gases. It is also used as a catalyst and a cutting body of a catalyst, a reinforcing agent for silicone rubber, and a sizing agent used in the textile industry.

Product Detail

Product Tags

Risk Codes R37 – Irritating to the respiratory system
Safety Description S24/25 – Avoid contact with skin and eyes.

 

Silicon dioxide(CAS#14808-60-7)

quality
Physical properties of silica: colorless transparent crystals or amorphous powder, odorless. The melting point is 1710°C (square quartz), 1670°C (scale quartz); The boiling point is 2230°C. Aorphous powder can act with alkali, has stable physical and chemical properties, is easy to form, is inert, the melt is layered, and the expansion coefficient is small when heated.

Chemical properties of silica: almost insoluble in hydrofluoric acid, soluble in hydrofluoric acid to form silicon fluoride gas, and slowly react with hot concentrated phosphoric acid.

Preparation method
Using ethyl orthosilicate as raw material, it is first distilled efficiently to collect fractions at 160~168°C. Then, ethyl orthosilicate is mixed with ammonia and heated, and the reactants change from cloudy to viscous until the solution boils. Stop stirring, let the solution settle, and after centrifugation, dry it at low temperature for a certain period of time. Finally, the product is obtained by scorching at 900°C and cooling naturally.

use
Masking film and protective layer: impurity diffusion in transistors and integrated circuits; As a filler, it is used in epoxy casting, optical fiber, coating and other fields; It is used in the manufacture of glass, emission spectroscopy analysis reagents, and control of antimony concentration during antimony expansion in solid circuit production.


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